Fabrication engineering at the micro and nanoscale 4th edition pdf

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A thostormy and also available arrival to all areas of micro- and also nanofabrication


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Description

Designed for progressed undergraduate or first-year graduate courses in semiconductor or microdigital fabrication, Fabrication Engineering at the Micro- and also Nanorange, Fourth Edition, covers the entire fundamental unit processes offered to fabricate incorporated circuits and various other gadgets. With many type of functioned examples and also thorough illustrations, this engaging development gives the devices required to understand the frontiers of fabrication processes.


About the Author(s)

Stephen A. Campbell is the Bordeau Professor of Electrical and also Computer Engineering at the College of Minnesota and a fellow of IEEE.

See more: Brd Engineering Dimple Jig, Gas Block Dimpling Jig: Ar15

Reviews

"This is one of the finest texts in the field. It offers the the majority of complete coverage of fabrication approaches."--Xian-An Cao, West Virginia University

"I favor Campbell"s style and enjoy reading the message. The material is correct for the intfinished audience and tbelow are good recaps of background material."--Trevor Thornton, Arizona State University


Table of Contents

* = This section provides background product.** = This area consists of progressed product and also have the right to be omitted without loss of the fundamental content of the course.PART I. OVERVIEW AND MATERIALSChapter 1. An Review to Microdigital Fabrication1.1 Microdigital Technologies: A Simple Example1.2 Unit Processes and Technologies1.3 A Roadmap for the Course1.4 SummaryChapter 2. Semiconductor Substrates2.1 Phase Diagrams and Solid Solubility*2.2 Crystallography and also Crystal Structure*2.3 Crystal Defects2.4 Czochralski Growth2.5 Bridgman Growth of GaAs2.6 Float Zone and also Other Growth2.7 Wafer Preparation and also Specifications2.8 Outline and FutureTrendsProblemsReferencesPART II. UNIT PROCESSES I: HOT PROCESSING AND ION IMPLANTATIONChapter 3. Diffusion3.1 Fick"s Diffusion Equation in One Dimension3.2 Atomistic Models of Diffusion 3.3 Analytic Solutions of Fick"s Law 3.4 Diffusion Coefficients for Common Dopants 3.5 Analysis of Diffused Propapers 3.6 Diffusion in SiO3.7 Simulations of Diffusion Prodocuments 3.8 SummaryProblems References Chapter 4. Thermal Oxidation4.1 The Deal-Grove Model of Oxidation4.2 The Liclose to and Parabolic Rate Coefficients4.3 The Initial Oxidation Regime 4.4 The Structure of SiO2 4.5 Oxide Characterization 4.6 The Effects of Dopants During Oxidation and also Polysilsymbol Oxidation 4.7 SiliconOxynitrides 4.8 Alternative Gate Insulators** 4.9 Oxidation Solution 4.10 Numeric Oxidations** 4.11 Rundown Problems References Chapter 5. Ion Implantation 5.1 Idealized Ion Implantation Solution 5.2 Coulomb Scattering* 5.3 Vertical Projected Range 5.4 Channeling and Lateral Projected Range 5.5 Implantation Damage 5.6 Shallow Junction Formation** 5.7 Buried Dielectrics** 5.8 Ion Implantation Systems: Problems and also Priorities 5.9 Numerical Implanted Profiles**5.10 Overview Problems References Chapter 6. Rapid Thermal Processing 6.1 Gray Body Radiation, Heat Exadjust, and also Optical Absorption6.2 High Intensity Optical Sources and also Chamber Deauthorize 6.3 Temperature Measurement6.4 Thermoplastic Stress* 6.5 Rapid Thermal Activation of Impurities 6.6 Rapid Thermal Processing of Dielectrics 6.7 Silicidation and also Contact Formation 6.8 Alteraboriginal Rapid Thermal Processing Systems 6.9 Synopsis Problems References PART III. UNIT PROCESSES 2: PATTERN TRANSFER Chapter 7. Optical Lithography 7.1 Lithography Rundown 7.2 Diffraction* 7.3 The Modulation Transfer Function and Optical Exposures 7.4 Source Equipment and Spatial Coherence 7.5 Contact/Proximity Printers 7.6 Projection Printers 7.7 Cutting edge Mask Concepts** 7.8 Surface Reflections and Standing Waves 7.9 Alignment 7.10 Outline Problems References Chapter 8. Photoresists 8.1 PhotoresistTypes 8.2 Organic Materials and also Polymers* 8.3 Typical Reactions of DQN Hopeful Photowithstand 8.4 Contrast Curves 8.5 The Critical Modulation Transfer Function 8.6 Applying and Developing Photowithstand 8.7 Second-Order Expocertain Effects 8.8 State-of-the-art Photoresists and also Photostand up to Processes** 8.9 Summary Problems References Chapter 9. Nonoptical Lithographic Techniques** 9.1 Interactions of High Energy Beams with Matter* 9.2 Direct-Write Electron Beam Lithography Solution 9.3 Direct-Write Electron Beam Lithography: Synopsis and also Outlook 9.4 X-ray and also EUV Sources* 9.5 Proximity X-ray Expocertain Systems 9.6 Membrane Masks for Proximity X-ray 9.7 EUV Lithography 9.8 Projection Electron Beam Lithography(SCALPEL) 9.9 E-beam and also X-ray Resists 9.10 Radiation Damage in MOS Devices 9.11 Soft Lithography and also Nanoimprint Lithography 9.12 Synopsis Problems References Chapter 10. Vacuum Science and Plasmas 10.1 The Kinetic Theory of Gases* 10.2 Gas Flow and Conductance 10.3 Prescertain Ranges and Vacuum Pumps10.4 Vacuum Seals and Pressure Measurement 10.5 The DC Glow Discharge* 10.6 RF Discharges 10.7 High Density Plasmas 10.8 Outline Problems References Chapter 11. Etching 11.1 Wet Etching 11.2 Chemical Mechanical Polishing 11.3 Basic Regimes of Plasma Etching 11.4 High Prescertain Plasma Etching 11.5 Ion Milling 11.6 Reactive Ion Etching 11.7 Damage in Reenergetic IonEtching** 11.8 High Density Plasma (HDP) Etching 11.9 Liftoff 11.10 Outline Problems References PART IV. UNIT PROCESSES 3: THIN FILMS Chapter 12. Physical Deposition: Evaporation and also Sputtering 12.1 Phase Diagrams: Sublimation and also Evaporation* 12.2 Deposition Rates 12.3 Step Coverage 12.4 Evaporator Systems: Crucible Heating Techniques 12.5 Multicomponent Films 12.6 An Review to Sputtering 12.7 Physics of Sputtering* 12.8 Deposition Rate: Sputter Yield 12.9 High Density Plasma Sputtering 12.10 Morphology and Step Coverage 12.11 Sputtering Methods 12.12 Sputtering of Specific Materials 12.13 Stress in Deposited Layers 12.14 Outline Problems ReferencesChapter 13. Chemical Vapor Deposition 13.1 A Simple CVD System for the Deposition of Silicon 13.2 Chemical Equilibrium and also the Law of Mass Action* 13.3 Gas Flow and also Boundary Layers* 13.4 Evaluation of the Simple CVD System 13.5 Atmospheric CVD of Dielectrics 13.6 Low Pressure CVD of Dielectrics and Semiconductors in Hot Wall Solution 13.7 Plasma-intensified CVD of Dielectrics 13.8 Metal CVD** 13.9 Atomic Layer Deposition 13.10 Electroplating Copper 13.11 Summary Problems References Chapter 14. Epitaxial Growth 14.1 Wafer Cleaning and also Native Oxide Removal 14.2 The Thermodynamics of Vapor Phase Growth 14.3 Surchallenge Reactions 14.4 Dopant Incorporation 14.5 Defects in Epitaxial Growth14.6 Selective Growth* 14.7 Halide Transport GaAs Vapor Phase Epitaxy 14.8 Incommensurate and also Strained Layer Heteroepitaxy 14.9 Metal Organic Chemical Vapor Deplace (MOCVD) 14.10 Cutting edge Silicon Vapor Phase Epitaxial Growth Techniques 14.11 Molecular Beam Epitaxy Technology 14.12 BCF Theory** 14.13 Gas Source MBE and also Chemical Beam Epitaxy** 14.14 Outline Problems References PART V. PROCESS INTEGRATION Chapter 15. Device Isolation, Contacts, and Metallization 15.1 Junction and Oxide Isolation 15.2 LOCOS Methods 15.3 Trench Isolation 15.4 Silicon-on-Insulator Isolation Techniques 15.5 Semi-insulating Substrates 15.6 Schottky Contacts 15.7 Implanted Ohmic Contacts 15.8Alloyed Contacts 15.9 Multilevel Metallization 15.10 Planarization and State-of-the-art Interattach 15.11 Rundown Problems References Chapter 16. CMOS Technologies 16.1 Basic Long-Channel Device Behavior 16.2 Early MOS Technologies 16.3 The Basic 3-µm Technology 16.4 Device Scaling 16.5 Hot Carrier Effects and Drain Engineering 16.6 Latchup 16.7 Shallow Source/Drains and also Tailored Channel Doping 16.8 The Universal Curve and Advanced CMOS 16.9 A Nanoscale CMOS Process16.10 Nonplanar CMOS16.11 Outline Problems References Chapter 17. Other Transistor Technologies 17.1 Basic MESFET Operation 17.2 Basic MESFET Technology 17.3 Digital Technologies 17.4 MMIC Technologies17.5 MODFETs 17.6 Recheck out of Bipolar Devices: Ideal and Quasi-appropriate Behavior 17.7 Performance of BJTs 17.8 Early Bipolar Processes 17.9 State-of-the-art Bipolar Processes 17.10 BiCMOS 17.11 Thin Film Transistors 17.12 Synopsis Problems References Chapter 18. Optoelectronic and also Solar Technologies 18.1 Optodigital Devices Summary 18.2 Direct-Space Inorganic LEDs 18.3 Polymer/Organic Light-Emitting Diodes 18.4 Lasers 18.5 Photovoltaic Devices Overview18.6 Silicon Based Photovoltaic Device Fabrication18.7 Other Photovoltaic Technologies18.8 Summary References Chapter 19. MEMS 19.1 Fundamentals of Mechanics 19.2 Stress in Thin Films 19.3 Mechanical-to-Electrical Transduction19.4 Mechanics of Usual MEMS Devices 19.5 Bulk Micromachining Etching Techniques 19.6 Bulk Micromachining Process Flow19.7 Surconfront Micromachining Basics 19.8 Surconfront Micromachining Process Flow 19.9 MEMS Actuators19.10 High Aspect Ratio Microdevices Technology (HARMST) 19.11 Microfluidics19.12 Overview Problems References Appendix I. Acronyms and Typical Symbols Appendix II. Properties of Schosen Semiconductor Materials Appendix III. Physical Constants Appendix IV. Conversion Factors Appendix V. Some Properties of the Error Function Appendix VI. F Values Index